High temperature co-fired ceramic (HTCC) is a multi-layer packaging technology for the electronics industry, used in military electronics, MEMS, microprocessor and RF applications. [1]
HTCC packages generally consist of multilayers of alumina oxide with tungsten and molymanganese metalization. The ceramic is fired at around 1600 degrees Celsius[2], which is significantly higher than a similar technology Low temperature co-fired ceramic, or LTCC. Compared to LTCC, HTCC has higher resistance conductive layers.
Advantages of HTCC includes mechanical rigidity and hermeticity, both of which are important in high-reliability and environmentally stressful applications. Another advantage is HTCC's thermal dissipation capability, which makes this a microprocessor packaging choice, especially for higher performance processors.[3]